Soldering and Cleaning in Electronics: an update
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29 March
2022
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Ground floor stage
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After an introduction of Inventec, the presentation will describe the main soldering processes and products used in electronic assembly with the new requirements from the industry and solutions.
The following topics will be discussed : heterogeneous assembly, voids level in critical power components, chemical reliability of solder paste and selective wave flux residues, their compatibility with conformal coatings and fluoropolymer based ultra-thin coatings
The second part will focus on challenge of cleaning the wave and paste residues, as such operations remain necessary for some applications, depending on the mission profile of the electronic assembly.
